GVT speeds up expansion in front-end semiconductor market after bagging TSV project

It was awarded by a global leader in wafer fabrication equipment and services.

Grand Venture Technology Limited (GVT) has fast-tracked its expansion into the front-end semiconductor market after it secured a Through-Silicon VIA (TSV) project.

The project, awarded by a global leader in wafer fabrication equipment and services, requires GVT to manufacture components and modules, according to a bourse filing.

TSV technology is a critical leap in semiconductor manufacturing that enables the delivery of performance and efficiency.

With its ability to allow for high-density stacking and direct vertical connections, TSV is a foundational technology for next-generation chips, which power high-value and fast-growing segments such as artificial intelligence, IoT, and advanced computing.

The group anticipates that this expansion will contribute to “driving new opportunities and revenue growth momentum from 2025 onwards.”

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