, Singapore
206 views
Photo by Pixabay on Pexels

GVT speeds up expansion in front-end semiconductor market after bagging TSV project

It was awarded by a global leader in wafer fabrication equipment and services.

Grand Venture Technology Limited (GVT) has fast-tracked its expansion into the front-end semiconductor market after it secured a Through-Silicon VIA (TSV) project.

The project, awarded by a global leader in wafer fabrication equipment and services, requires GVT to manufacture components and modules, according to a bourse filing.

TSV technology is a critical leap in semiconductor manufacturing that enables the delivery of performance and efficiency.

With its ability to allow for high-density stacking and direct vertical connections, TSV is a foundational technology for next-generation chips, which power high-value and fast-growing segments such as artificial intelligence, IoT, and advanced computing.

The group anticipates that this expansion will contribute to “driving new opportunities and revenue growth momentum from 2025 onwards.”

Follow the link for more news on

Join Singapore Business Review community
Since you're here...

...there are many ways you can work with us to advertise your company and connect to your customers. Our team can help you dight and create an advertising campaign, in print and digital, on this website and in print magazine.

We can also organize a real life or digital event for you and find thought leader speakers as well as industry leaders, who could be your potential partners, to join the event. We also run some awards programmes which give you an opportunity to be recognized for your achievements during the year and you can join this as a participant or a sponsor.

Let us help you drive your business forward with a good partnership!